PRODUCT DETAILS
Description
STAMPS3is a highly integrated embedded main control core module, using Lexin ESP32-S3FN8main control chip,8MSPI flash memory, equipped with high-performance Xtensa 32-bit LX7 dual-core processor, main frequency up to 240MHz. Built-in highly integrated 5V to 3.3V circuit, RGB status indicator, programmable button, module leads out ESP32-S3 all GPIO, and in the form of 1.27MM/2.54MM spacing lead, support SMT, DIP row, DIP row and Jump wireand other ways of use; The product features compact volume, strong performance, rich expansion IO and low power consumption. The module is suitable for IoT application scenarios with embedded main control modules.
Features
- ESP32-S3FN8(2.4GHz Wi-Fi)
- Minimal system board
- Multi-IO lead-out, support multiple application forms (SMT, DIP, flying wire)
- Integrated programmable RGB LEDs and buttons
- Support UIFlow graphical programming
Includes
- 1x StampS3
- 1x HY2.0-4P terminal
- 1 x 2.54-9P header
- 1 x 2.54-6P header
- 1 x Hex Key
- 1 × User manual
Applications
- Smart home
- Wearables
- Medical equipment
Specification
| Resources | Parameters |
|---|---|
| MCU | ESP32-S3FN8 |
| DCDC | Highly integrated MUN3CAD01-SC |
| Flash | 8MB |
| Input voltage | 5V |
| Interactive | Programmable physical buttons x 1, programmable RGB LED (WS2812B-2020) x 1 |
| Antenna type | 2.4G 3D antenna |
| Module resource interface | Touch sensor, SD/SDIO/MMC master controller, SPI, SDIO/SPI slave controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, GPIO, pulse counter |
| IO interface x23 | G0/G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11/G12/G13/G14/G15/G39/G40/G41/G42/G43/G44/G46 |
| Connection method | SMT/DIP (pitch 2.54mm and 1.27mm)/Jump Wire |
| IO interface spacing | 2.54mm和1.27mm |
| Operating temperature | 0°C to 40°C |
| Product Size | 26mm × 18mm × 5mm |
| Package Size | 136mm × 92mm × 13mm |
| Product Weight | 3.2g |
| Package Weight | 7.5g |